Processing & Packaging
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PROCESSING & PACKAGING:

Semiconductor Processing: A number of processing operations are involved in the manufacture of semiconductor-based devices and circuits. Typical operations include lithography, doping, thin-film growth, and thin-film deposition.

USP 6,184,582     USP 6,194,750     USP 6,222,863     USP 6,441,440
USP 6,762,128     USP 6,794,733    

Packaging: This refers to the manner in which a device (e.g., semiconductor device, etc.) is incorporated into a higher level package. Often, the nature of the device dictates the packaging requirements (e.g., hermetically sealed, etc.).

USP 6,734,538     USP 6,702,480     USP 6,368,888     USP 6,024,500     USP 5,960,017     USP 5,861,665

 
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